Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17268272
|
Filing Dt:
|
02/12/2021
|
|
Publication #:
|
|
Pub Dt:
|
08/12/2021
| | | | |
|
Inventors:
|
Akira MIYAMA, Mutsumi MATSUMOTO
|
|
Title:
|
ELECTROCONDUCTIVE RESIN COMPOSITION AND MOLDED ARTICLE OF SAME
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 1-1, NIHONBASHI-MUROMACHI 2-CHOME, CHUO-KU |
| TOKYO, JAPAN 1038338 |
|
|
|
|
| PEARNE & GORDON LLP |
| 1801 EAST 9TH STREET |
| SUITE 1200 |
| CLEVELAND, OH 44114-3108 |
|
|
Search Results as of:
05/05/2024 01:15 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
