Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/31/2023
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Application #:
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17167694
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Filing Dt:
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02/04/2021
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Publication #:
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Pub Dt:
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08/12/2021
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Inventors:
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Hiroshi SATOU, Gaku ECHIGOYA, Keijiro ISHIDA, Hajime KUDO
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Title:
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MULTILAYER CHIP COMPONENT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-5-1, NIHONBASHI, CHUO-KU |
| TOKYO, JAPAN 103-6128 |
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| JESSE O. COLLIER |
| OLIFF PLC |
| P.O. BOX 320850 |
| ALEXANDRIA, VA 22320-4850 |
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