Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
08/01/2023
|
Application #:
|
16787106
|
Filing Dt:
|
02/11/2020
|
|
Publication #:
|
|
Pub Dt:
|
08/12/2021
| | | | |
|
Inventors:
|
Ming SHING, Yichi YEN, Chun Liang CHEN, Kuo Lun LO
|
|
Title:
|
HEIGHT ADJUSTABLE SEMICONDUCTOR WAFER SUPPORT
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 8, LI-HSIN ROAD 6, |
| HSIN-CHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
|
|
|
|
| COOPER LEGAL GROUP LLC |
| 1388 RIDGE ROAD, UNIT 1 |
| HINCKLEY, 44233 UNITED STATES |
|
|
Search Results as of:
05/29/2024 01:29 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
