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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
16986415
Filing Dt:
08/06/2020
Publication #:
Pub Dt:
08/19/2021
Inventors:
Hsin-Hao Huang, Gwo-Shyan Sheu, Yu-Chen Ma, Wen-Fu Chou
Title:
CHIP PACKAGE AND CIRCUIT BOARD THEREOF
Assignment: 1
Reel/Frame:
053418/0059Recorded: 08/06/2020Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/05/2020
Exec Dt:
08/05/2020
Exec Dt:
08/05/2020
Exec Dt:
08/05/2020
Assignee:
NO.3, LIHSIN 5 RD., HSINCHU SCIENCE PARK
HSINCHU, TAIWAN
Correspondent:
DEMIAN K. JACKSON
106 STARVALE LANE
SHIPMAN, VA 22971

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