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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
02/28/2023
Application #:
16800220
Filing Dt:
02/25/2020
Publication #:
Pub Dt:
08/26/2021
Inventors:
Sheng-Chun YANG, Yi-Ming LIN, Po-Wei LIANG, Chu-Han HSIEH, Chih-Lung CHENG, Po-Chih HUANG
Title:
METHOD FOR MANUFACTURING SEMICONDUCTOR WAFER WITH WAFER CHUCK HAVING FLUID GUIDING STRUCTURE
Assignment: 1
Reel/Frame:
052152/0354Recorded: 03/18/2020Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/03/2020
Exec Dt:
03/03/2020
Exec Dt:
03/04/2020
Exec Dt:
03/03/2020
Exec Dt:
03/03/2020
Exec Dt:
03/03/2020
Assignee:
NO.8, LI-HSIN RD.6, SCIENCE-BASED INDUSTRIAL PARK
HSINCHU, TAIWAN 300
Correspondent:
BIRCH, STEWART, KOLASCH & BIRCH, LLP
8110 GATEHOUSE ROAD, SUITE 100E
FALLS CHURCH, VA 22042

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