Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/06/2022
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Application #:
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17249084
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Filing Dt:
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02/19/2021
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Publication #:
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Pub Dt:
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08/26/2021
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Inventors:
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Rainer Frauwallner, Dietmar Drofenik, Patrick Fleischhacker
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Title:
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Cooling Profile Integration for Embedded Power Systems
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| FABRIKSGASSE 13 |
| LEOBEN, AUSTRIA 8700 |
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| SMITH TEMPEL BLAHA LLC DOCKETING DEPARTMENT |
| 50 GLENLAKE PARKWAY, SUITE 340 |
| ATLANTA, GA 30328 |
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06/01/2024 01:48 AM
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