Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17260586
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Filing Dt:
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01/15/2021
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Publication #:
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Pub Dt:
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09/02/2021
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Inventor:
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Etsuo Okahara
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Title:
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INJECTION MOLDING DIE, AND METHOD OF MANUFACTURING MOLDED PRODUCT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 47-1, KANDA-HIGASHI MATSUSHITA-CHO, CHIYODA-KU |
| TOKYO, JAPAN 101-0042 |
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| WOOD HERRON & EVANS LLP |
| 441 VINE STREET |
| 2700 CAREW TOWER |
| CINCINNATI, OH 45202 |
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