Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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05/28/2024
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Application #:
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17261250
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Filing Dt:
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01/19/2021
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Publication #:
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Pub Dt:
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09/02/2021
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Inventors:
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Gi Dae CHOI, Eon Seok LEE, Minsu KIM, Youngjoo KIM, Changhun YUN
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Title:
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THERMOPLASTIC RESIN COMPOSITION HAVING EXCELLENT HEAT RESISTANCE AND ELECTROMAGNETIC WAVE SHIELDING CAPACITY, METHOD OF PREPARING THERMOPLASTIC RESIN COMPOSITION, AND INJECTION-MOLDED ARTICLE MANUFACTURED USING THERMOPLASTIC RESIN COMPOSITION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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128, YEOUI-DAERO |
YEONGDEUNGPO-GU |
SEOUL, KOREA, REPUBLIC OF 07336 |
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FRANK J. MISKIEL |
DENTONS US LLP |
4655 EXECUTIVE DRIVE, SUITE 700 |
SAN DIEGO, CA 92121 |
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