Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/25/2022
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Application #:
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16852554
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Filing Dt:
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04/20/2020
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Publication #:
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Pub Dt:
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09/02/2021
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Inventors:
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Cheng-Chung Chiang, Yu-Po Chen, Ping-Ho Chu, Chih-Chun Yu
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Title:
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TRANSISTOR HEAT DISSIPATION MODULE AND ASSEMBLY METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 25, GUANGPU W. RD., GUANGZHOU SCIENCE CITY, GUANGZHOU HI-TECH INDUSTRIAL DEVELOPMENT ZONE, |
| GUANGZHOU, CHINA |
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| 22F., NO.392, RUEY KUANG RD., NEIHU, |
| TAIPEI, TAIWAN 11492 |
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| JCIPRNET |
| 8F-1, NO. 100, ROOSEVELT RD. SEC. 2, |
| TAIPEI, 100404 TAIWAN |
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