Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/05/2022
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Application #:
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16486499
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Filing Dt:
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08/16/2019
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Publication #:
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Pub Dt:
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09/09/2021
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Inventors:
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Esben Stroebech, Carsten Sletten, Anders Grove Sund, Philip Holler Langhorn et al
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Title:
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An Adhesive Wafer with an Integrated Release Layer
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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HOLTEDAM 1 |
HUMLEBAEK, DENMARK DK-3050 |
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COLOPLAST A/S |
HOLTEDAM 1 |
CORPORATE PATENTS |
HUMLEBAEK, DK-3050 DENMARK |
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09/20/2024 11:02 AM
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