Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17190818
|
Filing Dt:
|
03/03/2021
|
|
Publication #:
|
|
Pub Dt:
|
09/09/2021
| | | | |
|
Inventors:
|
Noriaki OKABE, Takuya SEINO, Ryota KOZUKA, Yasuhiro HAMADA, Yuutaro KISHI
|
|
Title:
|
WAFER PROCESSING METHOD
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 3-1, AKASAKA 5-CHOME |
| MINATO-KU, TOKYO, JAPAN 1076325 |
|
|
|
|
| ARMSTRONG TEASDALE LLP |
| 7700 FORSYTH BLVD. |
| SUITE 1800 |
| ST. LOUIS, MO 63105 |
|
|
Search Results as of:
05/02/2024 01:38 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
