Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/10/2023
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Application #:
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17010926
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Filing Dt:
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09/03/2020
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Publication #:
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Pub Dt:
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09/09/2021
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Inventors:
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Ayana AMANO, Takeshi WATANABE, Yuki SUGO, Keiichiro HATTORI
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Title:
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SEMICONDUCTOR DEVICE HAVING A RESIN LAYER SEALING A PLURALITY OF SECONDUCTOR CHIPS STACKED ON FIRST SEMICONDUCTOR CHIPS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-21, SHIBAURA 3-CHOME, MINATO-KU |
| TOKYO, JAPAN |
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| OBLON, ET AL. |
| 1940 DUKE STREET |
| ALEXANDRIA, VA 22314 |
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