Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17327027
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Filing Dt:
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05/21/2021
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Publication #:
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Pub Dt:
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09/09/2021
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Inventors:
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Tao ZHOU, Yong GAO
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Title:
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CHIP HEAT DISSIPATING STRUCTURE, CHIP STRUCTURE, CIRCUIT BOARD AND SUPERCOMPUTING DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| F2, BUILDING 25, COURTYARD 1, BAOSHENG SOUTH ROAD, |
| HAIDIAN DISTRICT, |
| BEIJING, CHINA 100192 |
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| AMPACC LAW GROUP, PLLC |
| 6100 219TH ST SW #580 |
| MOUNTLAKE TERRACE, WA 98043 |
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