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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
08/22/2023
Application #:
17341142
Filing Dt:
06/07/2021
Publication #:
Pub Dt:
09/23/2021
Inventors:
Tzer-Min Shen, Zhiqiang Wu, Chung-Cheng Wu, Ching-Wei Tsai, Kuan-Lun Cheng, Chih-Hao Wang et al
Title:
Integrated Circuit Structure and Method with Hybrid Orientation for FinFET
Assignment: 1
Reel/Frame:
056459/0866Recorded: 06/07/2021Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/25/2017
Exec Dt:
10/27/2017
Exec Dt:
10/26/2017
Exec Dt:
10/26/2017
Exec Dt:
10/26/2017
Exec Dt:
10/27/2017
Exec Dt:
10/27/2017
Assignee:
8, LI-HSIN RD. 6
HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondent:
HAYNES AND BOONE, LLP (24061) IP SECTION
2323 VICTORY AVENUE
SUITE 700
DALLAS, TX 75219

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