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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
03/12/2024
Application #:
17057981
Filing Dt:
11/23/2020
Publication #:
Pub Dt:
09/30/2021
Inventors:
Zhaowei JIA, Jian WANG, Hui WANG, Hongchao YANG
Title:
ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD
Assignment: 1
Reel/Frame:
055472/0811Recorded: 02/11/2021Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/01/2020
Exec Dt:
12/01/2020
Exec Dt:
12/01/2020
Exec Dt:
12/01/2020
Assignee:
BUILDING 4, NO.1690, CAI LUN ROAD
ZHANGJIANG HIGH-TECH PARK
SHANGHAI, CHINA 201203
Correspondent:
JEFFREY S. BERGMAN
909 FANNIN ST.
STE 3500
HOUSTON, TX 77010

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