Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17263149
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Filing Dt:
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01/25/2021
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Publication #:
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Pub Dt:
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09/30/2021
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Inventors:
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Masatake NAGAYA, Takahiro KANDA, Takeshi OKAMOTO, Satoshi TORIMI, Satoru NOGAMI et al
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Title:
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SiC WAFER AND MANUFACTURING METHOD FOR SiC WAFER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1, SHOWA-CHO, KARIYA-CITY |
| AICHI, JAPAN 4488661 |
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| 7-12, TAKESHIMA 5-CHOME |
| NISHIYODOGAWA-KU, OSAKA-SHI |
| OSAKA, JAPAN 5550011 |
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| 9-8, MEIEKI 4-CHOME |
| NAKAMURA-KU |
| NAGOYA, JAPAN 4508575 |
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| YIZHOU LIU |
| CALFEE, HALTER & GRISWOLD LLP |
| 1405 EAST SIXTH STREET |
| CLEVELAND, OH 44114-1607 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1, SHOWA-CHO, KARIYA-CITY |
| AICHI, JAPAN 4488661 |
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| 9-8, MEIEKI 4-CHOME, NAKAMURA-KU, NAGOYA |
| AICHI, JAPAN 4508575 |
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| RANKIN, HILL & CLARK LLP |
| 23755 LORAIN ROAD, SUITE 200 |
| NORTH OLMSTED, OH 44070 |
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