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Patent Assignment Abstract of Title

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Total Assignments: 2

Patent #:	11450536	Issue Dt:	09/20/2022	Application #:	17211951	Filing Dt:	03/25/2021
Publication #:	20210305067	Pub Dt:	09/30/2021
Inventors:	Daigi KAMIMURA, Tomoshi TANIYAMA, Kenji SHIRAKO, Hironori SHIMADA, Akira HORII et al
Title:	SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Assignment: 1

Reel/Frame:

055808/0001

Recorded: 04/01/2021

Pages: 66

Conveyance:

ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Assignors:

KAMIMURA, DAIGI

Exec Dt:

03/22/2021

TANIYAMA, TOMOSHI

Exec Dt:

03/23/2021

SHIRAKO, KENJI

Exec Dt:

03/22/2021

SHIMADA, HIRONARI

Exec Dt:

03/22/2021

HORII, AKIRA

Exec Dt:

03/22/2021

NAKADA, TAKAYUKI

Exec Dt:

03/22/2021

YAMASHITA, NORIHIRO

Exec Dt:

03/26/2021

Assignee:

KOKUSAI ELECTRIC CORPORATION

3-4, KANDAKAJI-CHO

CHIYODA-KU

TOKYO, JAPAN 101-0045

Correspondent:

VOLPE KOENIG

30 SOUTH 17TH STREET, 18TH FLOOR

PHILADELPHIA, PA 19103

Assignment: 2

Reel/Frame:

055884/0001

Recorded: 04/09/2021

Pages: 69

Conveyance:

CORRECTIVE ASSIGNMENT TO CORRECT THE SPELLING OF THE NAMES OF ASSIGNORS FOUR (4) AND SEVEN (7) PREVIOUSLY RECORDED ON REEL 055808 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT OF ASSIGNOR(S) INTEREST.

Assignors:

KAMIMURA, DAIGI

Exec Dt:

03/22/2021