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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
11/28/2023
Application #:
16829336
Filing Dt:
03/25/2020
Publication #:
Pub Dt:
09/30/2021
Inventors:
Ying Wang, Yikang Deng, Junnan Zhao, Andrew James Brown, Cheng Xu, Kaladhar Radhakrishnan
Title:
MAGNETIC STRUCTURES IN INTEGRATED CIRCUIT PACKAGE SUPPORTS
Assignment: 1
Reel/Frame:
052806/0114Recorded: 06/02/2020Pages: 12
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/24/2020
Exec Dt:
04/23/2020
Exec Dt:
05/08/2020
Exec Dt:
05/22/2020
Exec Dt:
04/24/2020
Exec Dt:
04/01/2020
Assignee:
2200 MISSION COLLEGE BOULEVARD
SANTA CLARA, CALIFORNIA 95054
Correspondent:
LAURA A. ZAGER
2816 LAGO VISTA LANE
PATENT CAPITAL GROUP
ROCKWALL, TX 75032

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