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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
08/01/2023
Application #:
17323454
Filing Dt:
05/18/2021
Publication #:
Pub Dt:
10/07/2021
Inventors:
RAHUL AGARWAL, MILIND S. BHAGAVAT, CHIA-HAO CHENG
Title:
INTEGRATED CIRCUIT PACKAGE WITH INTEGRATED VOLTAGE REGULATOR
Assignment: 1
Reel/Frame:
056276/0022Recorded: 05/18/2021Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/27/2019
Exec Dt:
03/27/2019
Exec Dt:
03/28/2019
Assignee:
2485 AUGUSTINE DRIVE
SANTA CLARA, CALIFORNIA 95054
Correspondent:
ADVANCED MICRO DEVICES INC., C/O KLS
797 SAM BASS ROAD #2559
ROUND ROCK, TX 78681

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