Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/22/2022
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Application #:
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16845404
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Filing Dt:
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04/10/2020
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Publication #:
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Pub Dt:
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10/14/2021
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Inventors:
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Krishna R. Tunga, Thomas Weiss, Charles Leon Arvin, Bhupender Singh, Brian W. Quinlan
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Title:
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ENLARGED CONDUCTIVE PAD STRUCTURES FOR ENHANCED CHIP BOND ASSEMBLY YIELD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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| CANTOR COLBURN LLP-IBM POUGHKEEPSIE |
| 20 CHURCH STREET |
| 22ND FLOOR |
| HARTFORD, CT 06103 |
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