Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/30/2024
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Application #:
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17312594
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Filing Dt:
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06/10/2021
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Publication #:
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Pub Dt:
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10/28/2021
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Inventors:
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Ruopeng Deng, Tianhua Yu, Xiaolan Ba, Yu Pan, Juwen Gao
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Title:
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ATOMIC LAYER DEPOSITION ON 3D NAND STRUCTURES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4650 CUSHING PARKWAY |
| FREMONT, CALIFORNIA 94538 |
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| WEAVER AUSTIN VILLENEUVE & SAMPSON LLP |
| P.O.BOX 70250 |
| OAKLAND, CA 94612-0250 |
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