Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/30/2023
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Application #:
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17281017
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Filing Dt:
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03/29/2021
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Publication #:
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Pub Dt:
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11/04/2021
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Inventors:
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Cheon Seok YANG, Ju Sung KIM, Jee Kwon PARK, Hyeon Mun JEONG, Jin Seong LEE
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Title:
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Thermoplastic Resin Composition and Molded Article Produced Therefrom
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 300, OLYMPIC-RO SONGPA-GU |
| SEOUL, KOREA, REPUBLIC OF 05551 |
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| ADDITON, HIGGINS & PENDLETON, P.A. |
| 10706 SIKES PLACE |
| SUITE 350 |
| CHARLOTTE, NC 28277 |
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05/30/2024 01:51 PM
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