Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/23/2023
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Application #:
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17374156
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Filing Dt:
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07/13/2021
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Publication #:
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Pub Dt:
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11/04/2021
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Inventors:
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Takashi Nakamitsu, Shuhei Matsumoto, Toshifumi Inamasu
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Title:
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BONDING APPARATUS, BONDING SYSTEM, BONDING METHOD, AND RECORDING MEDIUM
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3-1, AKASAKA 5-CHOME, MINATO-KU |
| TOKYO, JAPAN 107-6325 |
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| PEARNE & GORDON LLP |
| 1801 EAST 9TH STREET, SUITE 1200 |
| SUITE 1200 |
| CLEVELAND, OH 44114 |
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05/08/2024 01:22 PM
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