Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17283158
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Filing Dt:
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04/06/2021
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Publication #:
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Pub Dt:
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11/11/2021
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Inventors:
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Tatsuhiko AOKI, Aya USHIODA
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Title:
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METHOD FOR HEAT-TREATING SILICON WAFER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6-861-5, HIGASHIKO, SEIRO-MACHI |
| KITAKANBARA-GUN, NIIGATA, JAPAN 957-0197 |
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| BUCHANAN INGERSOLL & ROONEY PC |
| P.O. BOX 1404 |
| ALEXANDRIA, VA 22314-1404 |
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