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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
11621343
Issue Dt:
04/04/2023
Application #:
17379551
Filing Dt:
07/19/2021
Publication #:
20210351282
Pub Dt:
11/11/2021
Inventors:
Cheng-Yi PENG, Wen-Yuan CHEN, Wen-Hsing HSIEH, Yi-Ju HSU, Jon-Hsu HO, Song-Bor LEE et al
Title:
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICES
Assignment: 1
Reel/Frame:
056904/0750Recorded: 07/19/2021Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
PENG, CHENG-YI
Exec Dt:
10/06/2019
CHEN, WEN-YUAN
Exec Dt:
10/30/2019
HSIEH, WEN-HSING
Exec Dt:
11/01/2019
HSU, YI-JU
Exec Dt:
11/25/2019
HO, JON-HSU
Exec Dt:
10/31/2019
LEE, SONG-BOR
Exec Dt:
11/11/2019
TIEN, BOR-ZEN
Exec Dt:
11/28/2019
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, SCIENCE BASED INDUSTRIAL PARK
HSINCHU, TAIWAN 300
Correspondent:
MCDERMOTT WILL & EMERY LLP
THE MCDERMOTT BUILDING
500 NORTH CAPITOL STREET, N.W.
WASHINGTON, DC 20001

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