Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/10/2023
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Application #:
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17155657
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Filing Dt:
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01/22/2021
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Publication #:
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Pub Dt:
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11/18/2021
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Inventors:
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Hyuekjae Lee, Jongho Lee, Jihoon Kim, Taehun Kim, Sangcheon Park, Jinkyeong Seol et al
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Title:
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PACKAGED MULTI-CHIP SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 129, SAMSUNG-RO, YEONGTONG-GU |
| SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 16677 |
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| MYERS BIGEL, P.A. |
| 4140 PARKLAKE AVENUE |
| SUITE 600 |
| RALEIGH, NC 27612 |
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