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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
16884452
Filing Dt:
05/27/2020
Publication #:
20210375746
Pub Dt:
12/02/2021
Inventors:
Jeremy Ecton, Haobo Chen, Brandon C. Marin, Daryl Purcell, Matthew Tingey, Hongxia Feng et al
Title:
AIRGAP STRUCTURES FOR HIGH SPEED SIGNAL INTEGRITY
Assignment: 1
Reel/Frame:
052808/0638Recorded: 06/02/2020Pages: 22
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
FENG, HONGXIA
Exec Dt:
05/15/2020
ECTON, JEREMY
Exec Dt:
05/15/2020
ALEKSOV, ALEKSANDAR
Exec Dt:
05/16/2020
CHEN, HAOBO
Exec Dt:
05/30/2020
GUO, XIAOYING
Exec Dt:
05/25/2020
MARIN, BRANDON C.
Exec Dt:
05/14/2020
QIAN, ZHIGUO
Exec Dt:
05/13/2020
PURCELL, DARYL
Exec Dt:
05/20/2020
ARANA, LEONEL
Exec Dt:
05/26/2020
TINGEY, MATTHEW
Exec Dt:
05/28/2020
Assignee:
INTEL CORPORATION
2200 MISSION COLLEGE BLVD.
SANTA CLARA, CALIFORNIA 95054
Correspondent:
GREEN, HOWARD, & MUGHAL LLP.
5 CENTERPOINTE DRIVE
SUITE 400
LAKE OSWEGO, OR 97035

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