Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/08/2023
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Application #:
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17074107
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Filing Dt:
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10/19/2020
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Publication #:
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Pub Dt:
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12/02/2021
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Inventors:
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Ming-Fa Chen, Cheng-Feng Chen, Sung-Feng Yeh, Chuan-An Cheng
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Title:
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MULTI-LEVEL STACKING OF WAFERS AND CHIPS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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| SLATER MATSIL, LLP |
| 17950 PRESTON RD., SUITE 1000 |
| DALLAS, TX 75252 |
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