Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/09/2024
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Application #:
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16987437
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Filing Dt:
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08/07/2020
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Publication #:
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Pub Dt:
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12/09/2021
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Inventors:
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Jenny Shio Yin Ong, Seok Ling Lim, Bok Eng Cheah, Jackson Chung Peng Kong et al
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Title:
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INTERPOSER STRUCTURES AND METHODS FOR 2.5D AND 3D PACKAGING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2200 MISSION COLLEGE BLVD |
| SANTA CLARA, CALIFORNIA 95054 |
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| VIERING, JENTSCHURA & PARTNER MBB |
| C/O 444 BRICKELL AVENUE |
| SUITE 700 |
| MIAMI, FL 33131 |
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