Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/25/2022
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Application #:
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17337551
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Filing Dt:
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06/03/2021
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Publication #:
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Pub Dt:
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12/16/2021
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Inventors:
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Takahiro HATTORI, Hiroki SUDO, Daisuke SOUMA, Hiroshi OKADA
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Title:
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METHOD FOR FORMING BUMP ELECTRODE SUBSTRATE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 23, SENJU-HASHIDO-CHO, |
| ADACHI-KU, TOKYO, JAPAN 120-8555 |
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| MYERS WOLIN, LLC |
| 100 SOUTH JEFFERSON ROAD |
| SUITE 202 |
| WHIPPANY, NJ 07981-1009 |
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