Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/18/2022
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Application #:
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17194884
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Filing Dt:
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03/08/2021
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Publication #:
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Pub Dt:
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12/16/2021
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Inventors:
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Masakazu ADACHI, Shinsuke INOUE
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Title:
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WAFER SEPARATING APPARATUS, AND WAFER SEPARATING METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 29 HINOKIGAOKA MINAKUCHI-CHO |
| KOKA-CITY, SHIGA, JAPAN 528-0068 |
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| SUGHRUE MION, PLLC |
| SUGHRUE MION, PLLC |
| 2000 PENNSYLVANIA AVENUE, N.W. |
| SUITE 900, DC 20006 |
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