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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
11759909
Issue Dt:
09/19/2023
Application #:
17349367
Filing Dt:
06/16/2021
Publication #:
20210394335
Pub Dt:
12/23/2021
Inventors:
Jae In AHN, Kyung Hwan KIM, Sung Hoon YUN, Jang Won SEO, Kang Sik MYUNG
Title:
POLISHING PAD, PREPARATION METHOD THEREOF AND METHOD FOR PREPARING SEMICONDUCTOR DEVICE USING SAME
Assignment: 1
Reel/Frame:
056565/0227Recorded: 06/16/2021Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
AHN, JAE IN
Exec Dt:
05/12/2021
KIM, KYUNG HWAN
Exec Dt:
05/12/2021
YUN, SUNG HOON
Exec Dt:
05/12/2021
SEO, JANG WON
Exec Dt:
05/12/2021
MYUNG, KANG SIK
Exec Dt:
05/12/2021
Assignee:
SKC SOLMICS CO., LTD.
1043, GYEONGGI-DAERO, PYEONGTAEK-SI
GYEONGGI-DO, KOREA, REPUBLIC OF 17784
Correspondent:
IP & T GROUP LLP
8230 LEESBURG PIKE
SUITE 650
VIENNA, VA 22182
Assignment: 2
Reel/Frame:
062717/0084Recorded: 02/13/2023Pages: 5
Conveyance:
CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Assignor:
SKC SOLMICS CO., LTD.
Exec Dt:
01/01/2023
Assignee:
SK ENPULSE CO., LTD.
1043, GYEONGGI-DAERO, PYEONGTAEK-SI
GYEONGGI-DO, KOREA, REPUBLIC OF
Correspondent:
IP&T GROUP LLP
102 MAPLE AVE. E
VIENNA, VA 22180

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