Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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12/26/2023
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Application #:
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17480185
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Filing Dt:
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09/21/2021
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Publication #:
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Pub Dt:
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01/06/2022
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Inventor:
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Toshikazu HARADA
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Title:
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METHOD OF MANUFACTURING MULTILAYER SUBSTRATE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1, SHOWA-CHO |
| KARIYA-CITY, AICHI-PREF., JAPAN 448-8661 |
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| HARNESS, DICKEY & PIERCE, PLC |
| 5445 CORPORATE DRIVE |
| SUITE 200 |
| TROY, MI 48098 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 10-1, HIGASHIKOTARI 1-CHOME |
| NAGAOKAKYO-SHI, KYOTO, JAPAN 617-8555 |
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| HARNESS, DICKEY & PIERCE, PLC |
| 5445 CORPORATE DRIVE |
| SUITE 200 |
| TROY, MI 48098 |
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