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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
17291725
Filing Dt:
05/06/2021
Publication #:
Pub Dt:
01/13/2022
Inventors:
Zeno Müller, Tino Filipiak-Ressel, Holger Beer, Lars Paulsen, Alexander Streibel
Title:
MOLD TOOL FOR MOLDING A SEMICONDUCTOR POWER MODULE WITH TOP-SIDED PIN CONNECTORS AND METHOD OF MANUFACTURING SUCH A SEMICONDUCTOR POWER MODULE
Assignment: 1
Reel/Frame:
058008/0121Recorded: 11/03/2021Pages: 17
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
05/18/2021
Exec Dt:
09/29/2021
Exec Dt:
04/20/2021
Exec Dt:
04/06/2021
Exec Dt:
04/06/2021
Assignee:
HUSUMER STRASSE 251
FLENSBURG, GERMANY 24941
Correspondent:
MARINA F. CUNNINGHAM, MCCORMICK, PAULDIN
185 ASYLUM STREET, CITYPLACE II, 18TH FL
6495-1181WOUS
HARTFORD, CT 06103-3410

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