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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
03/22/2022
Application #:
16932376
Filing Dt:
07/17/2020
Publication #:
Pub Dt:
01/20/2022
Inventor:
Cheng-Hsiang FAN
Title:
SEMICONDUCTOR DEVICE WITH MULTI-LAYER CONNECTING STRUCTURE AND METHOD FOR FABRICATING THE SAME
Assignment: 1
Reel/Frame:
053303/0936Recorded: 07/24/2020Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
05/27/2020
Assignee:
NO.98, NANLIN RD., TAISHAN DIST.,
NEW TAIPEI CITY, TAIWAN 243
Correspondent:
MUNCY, GEISSLER, OLDS & LOWE, PC
4000 LEGATO RD., SUITE 310
FAIRFAX, VA 22033

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