Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17299309
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Filing Dt:
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06/03/2021
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Publication #:
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Pub Dt:
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01/27/2022
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Inventors:
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Hironori IKENO, Kazuya SUWA, Keisuke NISHIZAWA, Ayaka KIYA, Kiichi KAWABATA
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Title:
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CONDENSATION-CURABLE RESIN COMPOSITION, CURED PRODUCT, MOLDED BODY, AND SEMICONDUCTOR DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-1, OTEMACHI 2-CHOME, CHIYODA-KU, |
| TOKYO, JAPAN 100-8105 |
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| JCIPRNET |
| 8F-1, NO. 100, ROOSEVELT RD. SEC. 2, |
| TAIPEI, 100404 TAIWAN |
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