Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
Total Assignments:
1
|
Patent #:
|
|
Issue Dt:
|
12/13/2022
|
Application #:
|
17157520
|
Filing Dt:
|
01/25/2021
|
Publication #:
|
|
Pub Dt:
|
01/27/2022
| | | | |
Inventors:
|
Fong-yuan Chang, Po-Hsiang Huang, Lee-Chung Lu, Jyh Chwen Frank Lee, Yii-Chian Lu et al
|
Title:
|
HEAT DISSIPATION IN SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME
|
|
Assignment:
1
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
HSINCHU, TAIWAN 300-78 |
|
|
|
SLATER MATSIL, LLP/TSMC |
17950 PRESTON ROAD, SUITE 1000 |
DALLAS, TX 75252 |
|
|
Search Results as of:
05/14/2024 11:20 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|