Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/19/2023
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Application #:
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17496158
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Filing Dt:
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10/07/2021
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Publication #:
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Pub Dt:
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01/27/2022
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Inventor:
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Naoki TOKUDA
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Title:
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TFT ARRAY SUBSTRATE INCLUDING A HEAT DISSIPATION LAYER IN A CURVED REGION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3-7-1, NISHI-SHINBASHI |
| MINATO-KU, JAPAN 105-0003 |
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| MAIER & MAIER, PLLC |
| 345 SOUTH PATRICK STREET |
| ALEXANDRIA, VA 22314 |
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04/29/2024 05:34 AM
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