Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17384418
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Filing Dt:
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07/23/2021
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Publication #:
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Pub Dt:
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02/03/2022
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Inventors:
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Francois GUYADER, Pascal BESSON
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Title:
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METHOD OF WAFER ASSEMBLY BY MOLECULAR BONDING
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Assignment:
1
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 29 BOULEVARD ROMAIN ROLLAND |
| MONTROUGE, FRANCE 92120 |
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| TESSA MCCLURE |
| 701 FIFTH AVENUE, SUITE 5400 |
| SEED IP LAW GROUP LLP |
| SEATTLE, WA 98104 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 850 RUE JEAN MONNET |
| CROLLES, FRANCE 38920 |
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| TESSA MCCLURE |
| 701 FIFTH AVENUE, SUITE 5400 |
| SEED IP LAW GROUP LLP |
| SEATTLE, WA 98104 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 29 BOULEVARD ROMAIN ROLLAND |
| MONTROUGE, FRANCE 92120 |
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| TESSA MCCLURE |
| 701 FIFTH AVENUE, SUITE 5400 |
| SEED IP LAW GROUP LLP |
| SEATTLE, WA 98104 |
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