Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/04/2023
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Application #:
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17383162
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Filing Dt:
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07/22/2021
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Publication #:
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Pub Dt:
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02/03/2022
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Inventor:
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Toyoji SAWADA
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Title:
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METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-10-23 SHIN-YOKOHAMA, KOHOKU-KU, YOKOHAMA-SHI |
| KANAGAWA, JAPAN 222-0033 |
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| MCDERMOTT WILL & EMERY LLP |
| THE MCDERMOTT BUILDING |
| 500 NORTH CAPITOL STREET, N.W. |
| WASHINGTON, DC 20001 |
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