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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
10/10/2023
Application #:
17389294
Filing Dt:
07/29/2021
Publication #:
Pub Dt:
02/03/2022
Inventors:
Eakkasit DUMSONG, Mike Jayson CANDELARIO, Phongsak Sawasdee et al
Title:
HERMETIC SEMICONDUCTOR PACKAGES
Assignment: 1
Reel/Frame:
057028/0211Recorded: 07/29/2021Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/23/2021
Exec Dt:
07/27/2021
Exec Dt:
07/27/2021
Exec Dt:
07/29/2021
Exec Dt:
07/27/2021
Exec Dt:
07/27/2021
Assignee:
22 ANG MO KIO INDUSTRIAL PARK 2
SINGAPORE, SINGAPORE 569506
Correspondent:
HORIZON IP PTE LTD
7500A BEACH ROAD
#04-306/308 THE PLAZA
SINGAPORE, 199591 SINGAPORE

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