Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/08/2022
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Application #:
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17278611
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Filing Dt:
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03/22/2021
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Publication #:
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Pub Dt:
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02/03/2022
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Inventors:
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Koji NISHIMURA, Yuta TSUGAWA, Ryota AONO
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Title:
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BONDED SUBSTRATE, METAL CIRCUIT BOARD, AND CIRCUIT BOARD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1, NIHONBASHI-MUROMACHI 2-CHOME, CHUO-KU |
| TOKYO, JAPAN 103-8338 |
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| MEGAN BOWERS |
| OLIFF PLC |
| P.O. BOX 320850 |
| ALEXANDRIA, VA 22320-4850 |
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04/27/2024 03:49 PM
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