Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17276477
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Filing Dt:
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03/15/2021
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Publication #:
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Pub Dt:
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02/10/2022
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Inventors:
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Satoru NAKAGAWA, Nobuyuki HIRONAKA, Kosuke UOTANI, Hideto OHASHI, Hironao SASAKI et al
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Title:
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COPOLYMERIZED POLYESTER RESIN, MOLDED PRODUCT, AND HEAT-SHRINKABLE FILM
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-8, DOJIMA HAMA 2-CHOME, KITA-KU |
| OSAKA-SHI, OSAKA, JAPAN 530-8230 |
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| JOHN KILYK, JR. |
| LEYDIG, VOIT & MAYER, LTD. |
| TWO PRUDENTIAL PLAZA, SUITE 4900 |
| CHICAGO, IL 60601-6731 |
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05/02/2024 03:51 AM
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