Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/27/2024
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Application #:
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17509293
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Filing Dt:
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10/25/2021
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Publication #:
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Pub Dt:
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02/10/2022
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Inventors:
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Wei-Hao Liao, Hsi-Wen Tien, Chih Wei Lu, Pin-Ren Dai, Chung-Ju Lee
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Title:
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Methods Of Etching Metals In Semiconductor Devices
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8, LI-HSIN RD. 6 |
| HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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| HAYNES AND BOONE, LLP |
| 2323 VICTORY AVENUE |
| DALLAS, TX 75219 |
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05/15/2024 01:28 PM
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