Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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02/20/2024
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Application #:
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17507653
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Filing Dt:
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10/21/2021
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Publication #:
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Pub Dt:
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02/10/2022
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Inventor:
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Naoki HAYASHI
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Title:
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WIRING SUBSTRATE, SEMICONDUCTOR PACKAGE HAVING THE WIRING SUBSTRATE, AND MANUFACTURING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1913-2, TAKEGASHITA FUKURA |
| USUKI-SHI, OITA, JAPAN 875-0053 |
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| LAW OFFICE OF KEVIN JACKSON |
| 6315 E. CACTUS WREN RD |
| PARADISE VALLEY, 85253 UNITED STATES |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 491B RIVER VALLEY ROAD |
| VALLEY POINT #12-03, SINGAPORE 248373 |
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| LAW OFFICE OF KEVIN B JACKSON |
| 6315 E CACTUS WREN RD |
| PARADISE VALLEY, AZ 85253-8006 |
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Assignment:
3
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 1913-2, TAKEGASHITA FUKURA |
| USUKI-SHI, OITA, JAPAN 875-0053 |
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| LAW OFFICE OF KEVIN B JACKSON |
| 6315 E CACTUS WREN RD |
| PARADISE VALLEY, AZ 85253-8006 |
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05/15/2024 09:26 AM
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