Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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11/08/2022
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Application #:
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17274390
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Filing Dt:
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03/08/2021
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Publication #:
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Pub Dt:
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02/17/2022
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Inventors:
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Kye Ung LEE, Ju Hwan CHUN, Tae Seok LEE, Ho Young PARK
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Title:
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POLYIMIDE FILM FOR SEMICONDUCTOR PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 272-27, MUNJI-RO, YUSEONG-GU |
| DAEJEON, KOREA, REPUBLIC OF 34050 |
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| HAUPTMAN HAM, LLP |
| 2318 MILL ROAD |
| SUITE 1400 |
| ALEXANDRIA, VA 22314 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE SECOND INVENTOR'S NAME AND EXECTION DATE PREVIOUSLY RECORDED AT REEL: 055534 FRAME: 0588. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT .
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| 272-27, MUNJI-RO, YUSEONG-GU |
| DAEJEON, KOREA, REPUBLIC OF 34050 |
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| HAUPTMAN HAM, LLP |
| 2318 MILL ROAD |
| SUITE 1400 |
| ALEXANDRIA, VA 22314 |
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06/04/2024 06:45 AM
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