Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17429063
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Filing Dt:
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08/06/2021
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Publication #:
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Pub Dt:
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02/17/2022
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Inventors:
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Koji INOUE, Keisuke KAWASHIMA, Kenichi FUJII, Takashi ODA
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Title:
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MATERIAL FOR FORMING UNDERLAYER FILM, RESIST UNDERLAYER FILM, AND LAMINATE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5-2, HIGASHI-SHIMBASHI 1-CHOME |
| MINATO-KU, TOKYO, JAPAN 105-7122 |
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| BUCHANAN INGERSOLL & ROONEY P.C. |
| 1737 KING STREET, SUITE 500 |
| ALEXANDRIA, VA 22314-2727 |
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