Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17600709
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Filing Dt:
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10/01/2021
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Publication #:
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Pub Dt:
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02/17/2022
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Inventor:
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Nobuyuki Terasaki
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Title:
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COPPER/CERAMIC JOINED BODY, INSULATION CIRCUIT BOARD, COPPER/CERAMIC JOINED BODY PRODUCTION METHOD, AND INSULATION CIRCUIT BOARD MANUFACTURING METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2-3, MARUNOUCHI 3-CHOME, CHIYODA-KU |
TOKYO, JAPAN 100-8117 |
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LOCKE LORD LLP |
701 8TH ST NW, SUITE 500 |
WASHINGTON, DE 20001 |
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05/14/2024 10:41 PM
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