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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
NONE
Issue Dt:
Application #:
17501857
Filing Dt:
10/14/2021
Publication #:
20220051973
Pub Dt:
02/17/2022
Inventors:
Jae Ung Lee, Yung Woo Lee, EunNaRa Cho, Dong Hyun Bang, Wook Choi, KooWoong Jeong et al
Title:
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Assignment: 1
Reel/Frame:
057799/0610Recorded: 10/14/2021Pages: 15
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
LEE, JAE UNG
Exec Dt:
04/09/2018
LEE, YUNG WOO
Exec Dt:
04/03/2018
BANG, DONG HYUN
Exec Dt:
06/05/2018
CHOI, WOOK
Exec Dt:
06/05/2018
JEONG, KOOWOONG
Exec Dt:
04/18/2018
KIM, BYONG JIN
Exec Dt:
04/03/2018
SHIN, MIN CHUL
Exec Dt:
05/28/2018
LIM, HO JEONG
Exec Dt:
06/05/2018
KIM, JI HYUN
Exec Dt:
04/18/2018
KIM, CHANG HUN
Exec Dt:
04/20/2018
Assignee:
AMKOR TECHNOLOGY, INC.
2045 E. INNOVATION CIRCLE
TEMPE, ARIZONA 85284
Correspondent:
MCANDREWS HELD & MALLOY, LTD
500 WEST MADISON STREET
SUITE 3400
CHICAGO, IL 60661
Assignment: 2
Reel/Frame:
057815/0739Recorded: 10/14/2021Pages: 43
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
AMKOR TECHNOLOGY, INC.
Exec Dt:
11/19/2019
Assignee:
AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
491B RIVER VALLEY ROAD
VALLEY POINT #12/03
SINGAPORE, SINGAPORE 248373
Correspondent:
MCANDREWS HELD & MALLOY, LTD
500 WEST MADISON STREET
SUITE 3400
CHICAGO, IL 60661
Assignment: 3
Reel/Frame:
066673/0517Recorded: 03/06/2024Pages: 15
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
CHO, EUNNARA
Exec Dt:
02/28/2024
Assignee:
AMKOR TECHNOLOGY, INC.
2045 E. INNOVATION CIRCLE
TEMPE, ARIZONA 85284
Correspondent:
PHILIP HENRY SHERIDAN
500 W. MADISON STREET
SUITE 3400
CHICAGO, IL 60661

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