Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/13/2022
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Application #:
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16994644
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Filing Dt:
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08/16/2020
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Publication #:
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Pub Dt:
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02/17/2022
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Inventors:
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RAMASAMY CHOCKALINGAM, JUAN BOON TAN, XIAODONG LI, KAI CHONG CHAN, RANJAN RAJOO
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Title:
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BONDING STRUCTURES OF SEMICONDUCTOR DEVICES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 60 WOODLANDS INDUSTRIAL PARK D STREET 2, |
| SINGAPORE, SINGAPORE 738406 |
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| GLOBALFOUNDRIES SINGAPORE PTE. LTD. |
| 60 WOODLANDS INDUSTRIAL PARK D STREET 2 |
| SINGAPORE, 738406 SINGAPORE |
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05/19/2024 02:43 AM
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